MetaTherm
APPLICATIONS

The universal case.

Any large-scale infrastructure project where heat management is an ongoing OPEX line item is a MetaTherm application.

The thermal semiconductor is hardware-agnostic and building-scale. Data centers are the primary surface; the same anisotropic physics underwrites three more verticals.

01

Data centers

Anisotropic envelope strips active cooling load from the building, not just the chip. R-6.05 → R-18.25 measured at the assembly level.

PRIMARY SURFACE
02

Defense & aerospace

Passive directional thermal control where active cooling is weight, power, or thermal signature the platform cannot afford. Solid-state, no fluids, no parasitic load.

AEROSPACE-LINEAGE TEAM
03

Pharma & cold chain

One-way thermal gating preserves controlled-temperature volumes with no compressor duty cycle. The envelope itself does the work.

ENVELOPE-INTEGRATED
04

Stadiums & venues

Building-scale anisotropy decouples interior thermal load from external climate at zero operating energy. Underwrites over a 20–30 year lifecycle.

BUILDING-ENVELOPE LIFECYCLE
· DATA CENTERS · DEEP DIVE

Where the geometry pays off, today.

Three near-term applications for AMM’s existing patent geometry in AI data-center thermal management. Each is a concrete cut of the same underlying anisotropic physics.

01
01 · ANISOTROPIC SPREADERS

Spread before you sink.

Bulk cold plates average over the die. They cannot pull harder where the hotspot is. Anisotropic thermal metamaterial spreaders engineer κ_x ≫ κ_z — high in-plane lateral conductivity, low through-plane — to laterally distribute hotspot energy before it reaches the heat sink. AMM’s anisotropic diaphragm IP (US 11,289,786) and resonator-array IP map directly to this geometry. Published baseline: Hu et al. 2020 J. Electronic Packaging.[2]
Target
B200 / GB200 die-attach lid
Form factor
50 – 200 µm thickness
Status
TRL 3–4 · design phase
Patents
US 11,289,786 · US 11,443,725 · US 10,616,679
Cited [2][14]
Anisotropic heat spreader with κ_x ≫ κ_z
02
02 · HOTSPOT CLOAKING

Steer heat around what cannot tolerate it.

HBM3e stacks dissipate 30–40 W in less than a square centimeter, located adjacent to compute die that operate at temperatures HBM cannot. A thermal cloak built from anisotropic metamaterial layers steers heat flux around the HBM and toward the cold plate. The transformation-optics analog has been experimentally demonstrated (Han et al. 2014).[8]AMM’s poro-elastic absorber IP (US 11,727,909) and spiral channel IP (US 10,701,478) map to this geometry.
Target
2.5D / CoWoS packaging
Form factor
Embedded inclusion in package substrate
Status
TRL 3–4 · design phase
Patents
US 11,727,909 · US 10,701,478
Cited [8][12]
03
03 · RACK ACOUSTIC LINERS

The only application demonstrated in production today.

Trinity College Dublin published, in Applied Acoustics 2023, a 15 mm-thick segmented-membrane sound-absorbing liner placed inside a server-rack deflector plate, achieving −2.5 dBA overall, −3 dB at the 620 Hz blade-passing frequency, and −43.9% sound power, in grazing flow.[5]This topology is precisely what AMM’s loudspeaker-enclosure patents describe (US 12,375,846 · US 11,721,314 · US 11,172,288). AMM does not need new IP to enter this market — only an integration partner.
Target
High-density (>30 kW) racks · OCP form factor
Form factor
15 mm liner · retrofittable
Status
TRL 5–6 · demonstrated in published research
Patents
US 12,375,846 · US 11,721,314 · US 11,172,288 · US 11,381,905
Cited [5]