AMMMetaTherm
APPLICATIONS

The universal case.

Any large-scale infrastructure project where heat management is an ongoing OPEX line item is a MetaTherm application.

The thermal semiconductor is hardware-agnostic and building-scale. Data centers are the primary surface; the same anisotropic physics underwrites three more verticals.

Rows of high-density racks in a darkened data hall
PRIMARY SURFACE · AI DATA CENTERS
01

Data centers

Anisotropic envelope strips active cooling load from the building, not just the chip. R-6.05 → R-18.25 measured at the assembly level.

PRIMARY SURFACE
02

Defense & aerospace

Passive directional thermal control where active cooling is weight, power, or thermal signature the platform cannot afford. Solid-state, no fluids, no parasitic load.

AEROSPACE-LINEAGE TEAM
03

Pharma & cold chain

One-way thermal gating preserves controlled-temperature volumes with no compressor duty cycle. The envelope itself does the work.

ENVELOPE-INTEGRATED
04

Stadiums & venues

Building-scale anisotropy decouples interior thermal load from external climate at zero operating energy. Underwrites over a 20–30 year lifecycle.

BUILDING-ENVELOPE LIFECYCLE
GPU accelerator package, studio detail
THE HOTTEST SQUARE CENTIMETERS IN THE BUILDING · 1000 W AT THE PACKAGE
· DATA CENTERS · DEEP DIVE

Where the geometry pays off, today.

Two near-term applications of MetaTherm’s patented geometry in AI data-center thermal management. Each is a concrete cut of the same underlying anisotropic physics.

01
01 · ANISOTROPIC SPREADERS

Spread before you sink.

Bulk cold plates average over the die. They cannot pull harder where the hotspot is. Anisotropic thermal metamaterial spreaders engineer κ_x ≫ κ_z — high in-plane lateral conductivity, low through-plane — to laterally distribute hotspot energy before it reaches the heat sink. MetaTherm’s patented anisotropic geometry maps directly to this application. Published baseline: Hu et al. 2020 J. Electronic Packaging.[2]
Target
B200 / GB200 die-attach lid
Form factor
50 – 200 µm thickness
Status
TRL 3–4 · design phase
Patents
PATENTED GEOMETRY
Cited [2][13]
Bare processor die on a dark logic board
κ_x ≫ κ_z · SPREAD LATERALLY BEFORE THE SINK · DIE-LEVEL DEPLOYMENT
02
02 · HOTSPOT CLOAKING

Steer heat around what cannot tolerate it.

HBM3e stacks dissipate 30–40 W in less than a square centimeter, located adjacent to compute die that operate at temperatures HBM cannot. A thermal cloak built from anisotropic metamaterial layers steers heat flux around the HBM and toward the cold plate. The transformation-optics analog has been experimentally demonstrated (Han et al. 2014).[7]MetaTherm’s patented layered geometry maps to this application.
Target
2.5D / CoWoS packaging
Form factor
Embedded inclusion in package substrate
Status
TRL 3–4 · design phase
Patents
PATENTED GEOMETRY
Cited [7][11]